Min. Required Track Width/Space & Annular Ring for Different Finished Copper Thicknesses
Cu Thickness Outer Width Outer Space Outer Annulus Inner Width Inner Space Inner Annulus
9 um 0.075 mm 0.075 mm 0.075 mm 0.075 mm 0.075 mm 0.075 mm
12 µm 0.075 mm 0.075 mm 0.075 mm 0.075 mm 0.075 mm 0.100 mm
18 µm 0.100 mm 0.100 mm 0.100 mm 0.100 mm 0.100 mm 0.125 mm
35 µm 0.150 mm 0.125 mm 0.125 mm 0.125 mm 0.125 mm 0.150 mm
50 µm 0.200 mm 0.175 mm 0.150 mm 0.150 mm 0.150 mm 0.175 mm
70 µm 0.250 mm 0.200 mm 0.150 mm 0.200 mm 0.200 mm 0.175 mm
105 µm 0.300 mm 0.250 mm 0.200 mm 0.300 mm 0.250 mm 0.200 mm
140 µm 0.350 mm 0.300 mm 0.250 mm 0.350 mm 0.300 mm 0.250 mm
210 µm 0.500 mm 0.450 mm 0.250 mm 0.500 mm 0.450 mm 0.250 mm
400 µm 0.800 mm 0.800 mm 0.250 mm 0.800 mm 0.800 mm 0.250 mm
Characteristics of Surface Finishes for Printed Circuit Boards
Characteristics H.A.L H.A.L
(Pb free)		 ENIG ENEPIG Hard Gold Soft Gold Silver OSP White Tin
Deposit Dipped Dipped Immersion Immersion Electrolytic Electrolytic Immersion Dipped Immersion
Process Control Poor Poor Fair Fair Fair Fair Fair Poor/Fair Fair
Process Cost Low Low Medium High High High Medium Low Medium
SMT Dome Dome Flat Flat Flat Flat Flat Flat Flat
Solderability Good Good Good Good Good Good Good Good Good
Thin Board Finish No No Yes Yes Yes Yes Yes Yes Yes
Thermal Cycle
(times)		 >2 >3 >2 >2 >2 >2 >2 ~2 >2
Shelf Life Long
(1+ Years)		 Long
(1+ Years)		 Long
(1+ Years)		 Long
(1+ Years)		 Long
(1+ Years)		 Long
(1+ Years)		 Medium(9-12 Months)* Medium(9-12 Months)* Medium(9-12 Months)*
Handling Normal Normal Normal Normal Normal Normal Critical Critical Normal
Exposed Copper No No No No Yes No No Yes No
Contact Applications No No Yes Au/Al Wire Bonding Yes Au/Al Wire Bonding No No No
Thickness 25-2,000 uin 25-2,000 uin 3-10 uin over 150-200 uin of Nickle 1-2 uin over 4-8 uin Palladium over 100-150 uin Nickle 98% Pure, 24 Carat, 30-50 uin over 100-150 uin of Nickle 99.99% Pure, 24 Carat, 30-50 uin over 100-200 uin of Nickle 1 uin over 30-50 uin of Copper 8-24 uin 25-60 uin
*Requires Unique Storage Techniques
uin=Microinches
Application of Surface Finishes for Printed Circuit Boards
Application H.A.L H.A.L(Pb free) ENIG ENEPIG Hard Gold Soft Gold Silver OSP White Tin
RoHS Compliant No Yes Yes Yes Yes Yes Yes Yes Yes
Fine Pitch SMT No No Yes Yes Yes Yes Yes Yes Yes
BGA & uBGA No No Yes Yes Yes Yes Yes Yes Yes
Flip Chip No No Yes Yes Yes Yes Yes Yes Yes
Wire Bonding No No No Yes Yes(Au) Yes No No No
Contact/Connector No No Yes Yes Yes Yes No No No
High Reliability High Low/Medium High High Medium/High High Medium/High Medium Medium
Solder Joint Integrity Excellent Good Good Good Poor Poor Excellent Good Good